Now updated to Revision E of the latest IPC-A-610 and J-STD-001 – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.
With only 38 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
DRM-SMT-E also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from both the IPC-A-610E and J-STD-001E are included for each of the acceptance criteria for further verification. In addition, every change from the D to E revision has been notated to make it easy for your inspectors and operators to learn the new requirements.
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