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Design Guide for the Packaging of High Speed Electronic Circuits

Product Code:2251
Language:English
Please see below for additional formats.
 
IPC Member: $57.00
Nonmember: $113.00
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Additional Formats:IPC MemberNonmember 
 2251(D)1: Design Guide for the Packaging of High Speed Electronic Circuits - Single User Download $62.00 $125.00Add to Cart
 2251(E)1: Design Guide for the Packaging of High Speed Electronic Circuits - Single User CD-ROM $62.00 $125.00Add to Cart
 2251(E)S: Design Guide for the Packaging of High Speed Electronic Circuits - Site License CD-ROM $1988.00 $3975.00Add to Cart
 
 


DESCRIPTION
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions. 99 pages. Released November 2003.

Preview the table of contents .pdf file.

Included in the IPC- C-105, IPC-C-106, & IPC-C-1000 collections.

 
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