This custom study was developed by Prismark Partners after being commissioned by the IPC Executive Market and Technology Forum. It covers the technology needs, challenges and opportunities that the trend toward miniaturization presents to all segments of the electronic interconnect industry. It assesses the drivers of miniaturization and related end-product trends, as well as new and evolving technologies that miniaturization is driving, such as embedded components, high-density interconnect (HDI) and connector types. The report explains where these technologies apply and where they are going. New research conducted for this study focused on three major end-product industries — personal computers, hand-held electronics, and infrastructure equipment for the datacom/telecom industry — and addresses the leading OEMs’ technology roadmap requirements.The study discusses the impact of miniaturization on the supply chain and how it will drive certain technology and business shifts. It also offers a forecast of future technology needs and market opportunities for all segments of the interconnect industry. Published December 2007.
FREE to IPC Members.
This .pdf report can be accessed on the Members Only area of the IPC Web site.
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