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Product Code:J-STD-005
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Nonmember: $55.00
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DOD Adopted 1995

Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.

Preview the table of contents .pdf file.

Included in the IPC-C-103 and the IPC-C-1000 Collections

Additional Languages
 J-STD-005-CNRequirements for Soldering Pastes - includes Amendment 1 - Chinese Language
 J-STD-005-JPRequirements for Soldering Pastes - includes Amendment 1 - Japanese Language
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