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Please note: IPC will be doing inventory from Monday, December 12 through Friday, December 16. Orders will be accepted but not processed until Monday, December 19.

IPC Holiday hours: IPC will be closed with no phone service:
Friday, December 23 through Monday, January 2

IPC will reopen on Tuesday, January 3. We will continue to accept orders via e-mail and web during our office closures. Please e-mail Customer Service at CustService@ipc.org or OrderIPC@ipc.org.

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Product Code:J-STD-005
IPC Member: $27.00
Nonmember: $55.00
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DOD Adopted 1995

Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.

Preview the table of contents .pdf file.

Included in the IPC-C-103 and the IPC-C-1000 Collections

Additional Languages
 J-STD-005-CNRequirements for Soldering Pastes - includes Amendment 1 - Chinese Language
 J-STD-005-JPRequirements for Soldering Pastes - includes Amendment 1 - Japanese Language
Related Products
 A-610EA-610E: Acceptability of Electronic Assemblies
 J-STD-001EJ-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies