IPC Masthead
You are not signed in | Login hereBack | Close
Online Store | Product Details
 
IPC is working hard to improve our services and how we serve you.
We will be performing significant system upgrades from Friday, May 26 through Thursday, June 1, 2017. All IPC systems will be off line and no business transactions will be conducted during this time.

New Releases Notification Service | IPC Market Research Reports | IPC Publications Catalog | License Information | International Distribution | Customer Service

 

Acceptability of Electronic Assemblies

Product Code:A-610F
ISBN:978-1-61193-154-9
Language:English
Please see below for additional formats.
 
IPC Member: $75.00
Nonmember: $148.00
Add to Cart
 
Additional Formats:IPC MemberNonmember 
 A-610F(E)1: Acceptability of Electronic Assemblies $80.00 $160.00Add to Cart
 A-610F(D)1: Acceptability of Electronic Assemblies $80.00 $160.00Add to Cart
 A-610F(E)S: Acceptability of Electronic Assemblies $2599.00 $5198.00Add to Cart
 A-610F-REDLINE(D)1: IPC-A-610 Revision E to Revision F Redline Comparison Document $27.00 $27.00Add to Cart
 
 


DESCRIPTION
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements. IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document synchronizes to the requirements expressed in other industry consensus documents and is most often used with the material and process standard IPC J-STD-001. 424 pages. Released July 2014.

DoD Adopted! Download the adoption notice (.pdf)

Preview the table of contents .pdf file.

Included in the IPC-C-103 & the IPC-C-1000 Collections.

IPC-A-610F Amendment 1 is now available. Information on purchasing the amendment can be found here

 
Additional Languages
 610FAM1-CN(D)1电子组件的可接受性 修订本1
 A-610FAM1-RO(D)1Acceptabilitatea Ansamblurilor Electronice Amendament 1 (Romanian language)
 A-610F-CN电子组件的可接受性 (Chinese Language)
 A-610F-DEAbnahmekriterien für elektronische Baugruppen (German Language)
 A-610F-DKGodkendelseskrav for elektronikprodukter (Danish Language)
 A-610F-FRAcceptabilité des assemblages électroniques (French Language)
 A-610F-HUElektronikai szerelvények elfogadhatósága (Hungarian Language)
 A-610F-IL-HEBREWקבלה של הרכבות אלקטרוניות (Hebrew Language)
 A-610F-ITIPC-A-610F include Emendamento 1
 A-610F-JP電子組立部品の許容基準 (Japanese Language)
 A-610F-KR전자 어셈블리에 대한 허용 가능성 (Korean Language)
 A-610F-ROAcceptabilitatea Ansamblurilor Electronice (Romanian Language)
 A-610F-RUКритерии приемки электронных сборок (Russian Language)
 A-610F-SEAcceptanskrav för kretskort (Swedish Language)
 A-610F-SPAceptabilidad de Ensambles Electrónicos (Spanish Language)
 A-610F-THมาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์ (Thai language)
 A-610F-TREk1'i içerir (Turkish Language)
 A-610F-VNYêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử (Vietnamese Language)
Related Products
 7530A7530A: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
 A-610FC-TelecomA-610FC-Telecom: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
 DRM-PTH-FDRM-PTH-F: Through Hole Solder Joint Evaluation Training & Reference Guide
 DRM-SMT-FDRM-SMT-F: Surface Mount Solder Joint Evaluation Training & Reference Guide
 7095C7095C: Design and Assembly Process Implementation for BGAs
 A-610F-REDLINE(D)1A-610F-REDLINE(D)1: IPC-A-610 Revision E to Revision F Redline Comparison Document
 A-620BA-620B: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies
 J-STD-001FJ-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies
 J-STD-001F-CNJ-STD-001F-CN: 焊接的电气和电子组件要求 (Chinese language)
 J-STD-003CJ-STD-003C: Solderability Tests for Printed Boards
 J-STD-020EJ-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices