IPC Masthead
You are not signed in | Login hereBack | Close
Online Store | Product Details

New Releases Notification Service | IPC Market Research Reports | IPC Publications Catalog | License Information | International Distribution | Customer Service


Superseded by 1601A: Printed Board Handling and Storage Guidelines

Product Code:1601
IPC Member: $39.00
Nonmember: $79.00
Add to Cart

The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, establishing recommended moisture levels, establishing baking profiles for moisture removal and the impact of baking on printed board solderability. 18 pages. Released August 2010.

Preview the table of contents .pdf file.

Included in the IPC-C-105 & the IPC-C-1000 Collections.

Additional Languages
 1601-CN印制板操作和贮存指南 (Chinese Language)
 1601-DEHandhabung und Lagerung von Leiterplatten (German Language)
Related Products
 2221B-FR2221B-FR: Norme Générique de Conception du Circuit imprimé (French Language)
 4553A4553A: Specification for Immersion Silver Plating for Printed Boards
 45544554: Specification for Immersion Tin Plating for Printed Circuit Boards
 45564556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo
 57035703: Cleanliness Guidelines for Printed Board Fabricators
 57045704: Cleanliness Requirements for Unpopulated Printed Boards
 6012C6012C: Qualification and Performance Specification for Rigid Printed Boards
 6012D6012D: Qualification and Performance Specification for Rigid Printed Boards
 6012D-FR6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides (Fren
 6012D-RL(D)16012D-RL(D)1: Qualification and Performance Specification for Rigid Printed Boards-Red Line