The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, establishing recommended moisture levels, establishing baking profiles for moisture removal and the impact of baking on printed board solderability. 18 pages. Released August 2010.
Preview the table of contents .pdf file.
Included in the IPC-C-105 & the IPC-C-1000 Collections.