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User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

Product Code:9631
ISBN:1-580986-79-X
Language:English
 
IPC Member: $75.00
Nonmember: $148.00
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DESCRIPTION

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment.11 pages. Released December 2010.

Preview the table of contents .pdf file.

Included in the C-1000 Collections.

 
Additional Languages
 9631-DERichtlinie für die Anwendung der IPC-TM-650, Methode 2.6.27, Thermischer Stress, Simulation des Konvektions-Reflow-Löten (German language
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