IPC Masthead
You are not signed in | Login hereBack | Close
Online Store | Product Details
 

Please note: IPC will be doing inventory from Monday, December 12 through Friday, December 16. Orders will be accepted but not processed until Monday, December 19.

IPC Holiday hours: IPC will be closed with no phone service:
Friday, December 23 through Monday, January 2

IPC will reopen on Tuesday, January 3. We will continue to accept orders via e-mail and web during our office closures. Please e-mail Customer Service at CustService@ipc.org or OrderIPC@ipc.org.

New Releases Notification Service | IPC Market Research Reports | IPC Publications Catalog | License Information | International Distribution | Customer Service

 

Analytical Procedures for Portable Lead-Free Alloy Test Data

Product Code:SPVC-LAT1
Language:English
Note:This product is downloadable.
 
IPC Member: $0.00
Nonmember: $0.00
Add to Cart
 
 
 


DESCRIPTION
If not completely characterized, many of the early lead-free alloys’ reliability properties are better understood than those of the new alloys being introduced today. Therefore, it can be quite difficult to compare alloy properties. The lack of reliability characterization of new materials introduces uncertainty for the user. To address this problem, the IPC Solder Products Value Council (IPC SPVC), in cooperation with several leading OEMs and EMS companies, has published this free white paper which details a set of test protocols for evaluation of new lead-free alloys on the basis of their physical properties, e.g., creep, and performance in the assembly of a standardized test vehicle. The goal of this white paper is to reduce the time and effort required to characterize an alloy and help the electronics assembly industry improve its processes without jeopardizing reliability. 10 pages. Released May 2010.

This product is free. Please "Add to Cart" to download this item. You will not be charged for this download.

 
Related Products
 J-STD-001EJ-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies