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Now updated to Revision F of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.
At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.
Useful as a training aid in the classroom or on the shop floor, DRM-SMT contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
This updated guide also covers solder joint quality standards for two new Area Array component types: Ball Grid Arrays (BGAs) and Bottom Termination Components (BTCs).
DRM-SMT-F also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from the IPC-A-610F are included for each of the acceptance criteria for further verification.
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