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An introductory overview of the surface mount assembly processes. Begins with a review of component evolution from through-hole to surface mount, then describes standard component types. Explains the solder paste printing process; mixed technology assembly — including adhesive application, autoplacement of components, reflow soldering, infrared (convection and combination), visual inspection, cleaning, secondary reflow, electrical and burn-in testing. A useful introduction for new hires, cross-training and general education. Time: 28 minutes.