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Stencil Design Guidelines

Product Code:7525B
IPC Member: $39.00
Nonmember: $79.00
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This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included. 14 pages. Released October 2011

Preview the table of contents .pdf file.

Additional Languages
 7525B-CN模板设计指导 (Chinese Language)
 7525B-DEDesignrichtlinie für Druckschablonen (German language)